Senior Equipment Engineer (Die Attach, Wire Bonding, Bumping) - #1090064

Who We Are:

Lumileds is a global leader in LED and microLED technology, innovation, and solutions for the automotive, display, illumination, mobile, and other markets where light sources are essential. Our approximately 3,500 employees operate in over 15 countries and partner with our customers to deliver never before possible solutions for lighting, safety, and well-being.

The Lumileds environment is fast-paced, cutting-edge, intelligent and fun! We are looking for exceptional talent to join our team! To learn more, visit lumileds.com.

Who You Are: 

You are an experienced and highly skilled Senior Equipment Engineer with a strong background in Die Attach and Wire Bonding process. You possess exceptional leadership abilities and technical expertise, making you the ideal candidate to lead OEE (Overall Equipment Efficiency) improvements and guide a team of equipment technicians. Your passion for continuous improvement, cost reduction, and machine performance optimization sets you apart in the field of semiconductor manufacturing. You have a solid educational background in Electrical & Electronics or Mechanical Engineering and are eager to contribute your knowledge to drive success in this role.

Position Summary: 

As a Senior Equipment Engineer for Die Attach and Wire Bonding, you will be responsible for leading efforts to enhance equipment performance, reliability, and efficiency within the Wafer Finishing manufacturing process. Your role will encompass managing a team of equipment technicians, overseeing fault investigations, optimizing machine performance, and ensuring throughput targets are met. Additionally, you will be responsible for maintaining equipment spare parts, reviewing maintenance controls and procedures, and driving cost reduction initiatives.

What You Will Do:

• Lead OEE Improvements: Drive initiatives to improve Overall Equipment Efficiency (OEE) by identifying and addressing equipment performance bottlenecks and downtime issues.
• Guide Equipment Technicians: Mentor and lead a team of equipment technicians in conducting fault investigations, troubleshooting equipment issues, and ensuring effective equipment maintenance.
• Continuous Equipment Improvements: Implement strategies for ongoing equipment enhancements, including upgrades, modifications, and optimization to meet production goals.
• Spare Parts Management: Maintain an inventory of critical equipment spare parts to minimize downtime and ensure the availability of necessary components.
• Review Maintenance Controls and Procedures: Evaluate and improve maintenance controls and procedures to maximize equipment reliability and lifespan.
• Drive Cost Reduction: Identify opportunities to reduce costs related to equipment parts, maintenance, and operations while maintaining high-quality standards.
• Other Duties: Perform additional responsibilities and tasks as assigned by the manager to support the overall success of the department.

What You Will Bring (REQUIRED Qualifications):

• Minimum 5 years experience in Die Attach, Wire Bonding , Bumping processes within the semiconductor manufacturing industry.
• Hands-on experience in equipment troubleshooting is a must have. 

Education (Minimum Level)

• Bachelor's

Field of Study

• Electrical/Electronics or Mechanical

Years of Experience (Minimum)

• 5 - 7 years

Preferred Qualifications: 

• Tool Platform Expertise: KNS , Panasonic and TDK tool platforms is advantageous and will be highly valued in this role.
• SPC Knowledge: Familiarity with Statistical Process Control (SPC) methods and Six Sigma Green Belt certification is desirable, demonstrating your commitment to quality and process improvement

Lumileds is an Equal Employment Opportunity Employer